QFP abbr. 四方扁平封装(Quad Flat Pack)
- Research effect of different ROL on pulling strength of QFP solder joint mainly in order to get the proper range of ROL.
主要研究了不同氧含量对QF P引脚焊点拉伸强度的影响,得到一个最佳的氧含量范围。 - In this paper, the geometry of solder joint of QFP is predicted according to the moist theory of liquid solder material and the principle of minimum energy.
本文根据液态焊料润湿理论和最小能量原理对QFP焊点的几何形态进行了预测。