英德
有道
百度
谷歌
图片
维基
百科
线的支撑
bearing of a line
- 在用于封装2000元碲镉汞焦平面芯片的分置式微型杜瓦研制中，详细阐明了一种焦平面芯片其装载面为斜拉式支撑结构的设计，实现了探测器外引功能线的布线优化及其输出引线工艺改进，并提出了一种大尺寸高气密光学窗口的焊接方法等关键技术。
During the course of the manufacture for packaging 2000 pixel HgCdTe IRFPA wafer, some crucial techniques are solved, such as the design of the button stem structures with inclined dragging wires applied in cryogenic platform, the optimization of long linear IRFPA detector's signal wires layouts, the implement of a fanout board having thin film gold metalization for defining the required electrical conductors and a method of hermetically sealed vacuum enclosure of large dimension windows, etc.
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